1. The Accelerant™ Solver
The new Accelerant Solver within CFdesign V9 uses proprietary
CPU optimization algorithms to radically reduce the time
it takes to achieve fully converged fluid-flow and heat-transfer
solutions. Testing conducted by Blue Ridge Numerics and
CFdesign customers show that simulation results for simple
models can be generated 40 percent faster than in previous
versions and extremely complex simulations can be completed
up to 2,000 percent faster.
2. Auto Mesh Sizing
By completely skipping the Mesh dialog from your analysis
set-up, the mesh distribution will be computed automatically
when the analysis is started. Auto mesh sizing performs
a comprehensive topological interrogation of the geometric
model, assigning mesh sizes based on curvature, geometric
gradients, and proximity to neighboring features. An
optimally sized surface and volume mesh ensures faster
mesh generation and higher-quality simulation results.
3. Rules on Parts
Intelligently detects MCAD part names within an assembly
and automatically assigns volumetric boundary conditions
and material properties. Boundary conditions include
heat generation and total heat generation, both of which
can be steady-state, transient or temperature dependent.
Materials are assigned from CFdesign's customizable library
of fluids, solids, printed circuit boards, and the newly
added two-resistor electronic components.
4. Geometry Diagnostics
Interrogates geometry to identify areas that may cause
difficulty in the determination of mesh sizes, the mesh
generation, and even in solution stability of the analysis.
V9
also identifies regions of the model that are quited
for extruded meshing. Upon hitting the 'Go' button the
model is automatically meshed with an optimal blend of
mesh sizes and shapes. V9 also identifies regions of the
model that are quited for extruded meshing. Upon hitting
the 'Go' button the model is automatically meshed with
an optimal blend of mesh sizes and shapes.
5. Extruded Meshing
This function stretches triangular faces into multiple
layers of wedge (prism) elements through the length of
3-D parts with a uniform cross section. This feature can
greatly reduce element count in high aspect-ratio parts,
and improve flow accuracy in models dominated by form drag,
such as pipe flow.
6. Forced Convection Automation
Press 'GO' on the Analyze dialog and the analysis will
run first as Flow-only until convergence is achieved.
Flow will then be disabled and heat transfer enabled
automatically to deliver a fully coupled forced convection
solution.
7. Internal Fan Velocity Profile Import
Allows the specification of the velocity profile for an
internal fan. It provides a mechanism to apply the velocity
distribution computed from a detailed rotating region
analysis to a simple geometric representation of that
fan in a subsequent system-level analysis.
8. PCB Characterizer
Provides a simple way to accurately include thermal characteristics
of any PCB material within a CFdesign simulation. The
unique properties of each copper and dielectric (FR-4)
layer are specified, allowing conductivities to be computed
automatically and applied within the simulation. Each
characterized PCB can be added to the CFdesign material
library for re-use, and can be automatically assigned
with the new rules on parts functionality.
The ability to quickly characterize the thermal performance
of PCB's and IC's allow engineers to find reliable thermal
design strategies. The ability to quickly characterize
the thermal performance of PCB's and IC's allow engineers
to find reliable thermal design strategies.
9. Compact Thermal Model
Only two parameters, Theta JB and Theta JC, are needed
to supply board temperature, junction temperature, case
temperature, heat transfer between junction and board,
and heat transfer between junction and case for every
component within the system. Supported microchip configurations
include BGA (ball grid array), PBGA (plastic ball grid
array), TBGA (taped ball grid array), FC-BGA (flip chip
ball grid array), QFP (quad flat pack), PQFP (plastic
quad flat pack), NQFP (no-lead quad flat pack), and SOIC/SOP
(small-outline IC/small-outline package).
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