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MPI Release 6.1
MPA

In-Depth Simulations for Design Validation and Optimization

The Moldflow Plastics Insight suite of software is the world's leading product for the in-depth simulations to validate part and mold design. Companies around the world have chosen Moldflow's solutions because they offer:

Unique, Patented Fusion Technology
MPI/Fusion, which is based on Moldflow's patented Dual Domain™ technology, allows you to analyze CAD solid models of thin-walled parts directly, resulting in a significant decrease in model preparation time. The time-savings allow you to analyze more design iterations as well as perform more in-depth analyses.

Powerful Workflow and Productivity Tools
The user-friendly environments in MPI employ visualization and project management tools that allow you to undertake extensive design analysis and optimization. After your analyses are complete, you can produce detailed, Web-ready design reports quickly and easily.

Proven Solutions for all Types of Applications
Moldflow's analysis products can simulate plastics flow and packing, mold cooling, and part shrinkage and warpage for thermoplastic injection molding, gas-assisted injection molding, co-injection molding and injection-compression molding processes. Additional modules simulate reactive molding processes including thermoset and rubber injection molding, reaction injection molding (RIM), structural reaction injection molding (SRIM), resin transfer molding, microchip encapsulation and Underfill (flip-chip) encapsulation.

 
MPI 6.0 MPI v6.1

What's new

Moldflow Plastics Insight (MPIŽ) 6.1 delivers new technologies and key enhancements that help you work more efficiently, significantly reduce solution time, interact better with CAD, structural analysis and other Moldflow applications, gain new details from analysis results, and choose among more options to communicate your findings.

MPI Modules

- MPI/Synergy
- MPI/Flow
- MPI/Cool
- MPI/Warp
- MPI/Fiber
- MPI/Optim
- MPI/Stress
- MPI/Shrink
- MPI/Gas
- MPI/MuCell
- MPI/Co-Injection
- MPI/Injection Compression
- MPI/Reactive Molding
- MPI/Microchip Encapsulation
- MPI/Underfill Encapsulation
- MPI/Fusion
- MPI/3D
- MPI/3D Gas-assist

 
 
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